(module "QFN50P400X400X90-25N-D" (layer F.Cu)
  (descr "(CP-24-16)")
  (tags "Integrated Circuit")
  (attr smd)
  (fp_text reference IC** (at 0 0) (layer F.SilkS)
    (effects (font (size 1.27 1.27) (thickness 0.254)))
  )
  (fp_text user %R (at 0 0) (layer F.Fab)
    (effects (font (size 1.27 1.27) (thickness 0.254)))
  )
  (fp_text value "QFN50P400X400X90-25N-D" (at 0 0) (layer F.SilkS) hide
    (effects (font (size 1.27 1.27) (thickness 0.254)))
  )
  (fp_line (start -2.625 -2.625) (end 2.625 -2.625) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.625 -2.625) (end 2.625 2.625) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.625 2.625) (end -2.625 2.625) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.625 2.625) (end -2.625 -2.625) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2 -2) (end 2 -2) (layer F.Fab) (width 0.1))
  (fp_line (start 2 -2) (end 2 2) (layer F.Fab) (width 0.1))
  (fp_line (start 2 2) (end -2 2) (layer F.Fab) (width 0.1))
  (fp_line (start -2 2) (end -2 -2) (layer F.Fab) (width 0.1))
  (fp_line (start -2 -1.5) (end -1.5 -2) (layer F.Fab) (width 0.1))
  (fp_circle (center -2.375 -2) (end -2.375 -1.875) (layer F.SilkS) (width 0.25))
  (pad 1 smd rect (at -2 -1.25 90) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -2 -0.75 90) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -2 -0.25 90) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -2 0.25 90) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at -2 0.75 90) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at -2 1.25 90) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at -1.25 2 0) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at -0.75 2 0) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at -0.25 2 0) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd rect (at 0.25 2 0) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd rect (at 0.75 2 0) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask))
  (pad 12 smd rect (at 1.25 2 0) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask))
  (pad 13 smd rect (at 2 1.25 90) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask))
  (pad 14 smd rect (at 2 0.75 90) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask))
  (pad 15 smd rect (at 2 0.25 90) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask))
  (pad 16 smd rect (at 2 -0.25 90) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask))
  (pad 17 smd rect (at 2 -0.75 90) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask))
  (pad 18 smd rect (at 2 -1.25 90) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask))
  (pad 19 smd rect (at 1.25 -2 0) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask))
  (pad 20 smd rect (at 0.75 -2 0) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask))
  (pad 21 smd rect (at 0.25 -2 0) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask))
  (pad 22 smd rect (at -0.25 -2 0) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask))
  (pad 23 smd rect (at -0.75 -2 0) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask))
  (pad 24 smd rect (at -1.25 -2 0) (size 0.3 0.75) (layers F.Cu F.Paste F.Mask))
  (pad 25 smd rect (at 0 0 0) (size 2.85 2.85) (layers F.Cu F.Paste F.Mask))
  (model HMC624ALP4ETR.stp
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz -90 0 0))
  )
)
